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Shenzhen Xuancai Electronic Co., Ltd

Shenzhen Xuancai Electronic Co.,Ltd, founded in 2007,is a professional manufacturer of high power cob chips.With a wide range, good quality and reasonable price,our products are extensively used in

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0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing

Shenzhen Xuancai Electronic Co., Ltd
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    Buy cheap 0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing from wholesalers
     
    Buy cheap 0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing from wholesalers
    • Buy cheap 0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing from wholesalers
    • Buy cheap 0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing from wholesalers
    • Buy cheap 0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing from wholesalers
    • Buy cheap 0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing from wholesalers
    • Buy cheap 0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing from wholesalers

    0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing

    Ask Lasest Price
    Brand Name : XUANCAI
    Model Number : 365 UV LED
    Certification : CE ROHS LM-80
    Price : $0.5-$ 1/ PCS
    Payment Terms : T/T, Western Union, Paypal , Alibaba trade assurance
    Supply Ability : 30000000 PCS/ Month
    Delivery Time : 4-7 days
    • Product Details
    • Company Profile

    0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing

    UV 365 LED Chip Korea LG Chip Good Quality 45*45 3 Years' Warranty 1600-2000mW CE ROHS For 3D Printing/ Ink Curing


    Applications

    ultraviolet disinfection/ uv curing/ UV Ink Curing/ Printing/ Moth-killing lamp/ l Medical treatment and health/ General use


    Product Parameters


    Product Information
    Item
    3W SMD LED
    Size
    35*35
    Current
    700mA
    Voltage
    3.2-3.8V
    Wavelength
    365-370nm
    Chip Brand
    LG
    Quantity/ Reel
    1000pcs
    Warranty
    Spanlife

    3 Years
    50000 hours

    Features

    1. Size(mm): 3.45×3.45×1.95         

    2. Ceramic and silicone molding package    

    3. Suitable for all SMT assembly and solder process    

    4. Wide viewing angle: 120°            

    5. Pb-free reflow soldering application         

    6. RoHS compliant 


    Package Dimensions

    0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing


    Typical Optical/ Electrical Characteristics @Ta=25

    Symbol

    Item

    Min.

    Typ.

    Max.

    Units

    Test Conditions


    IeRadiant intensitymW/srIF=700mA
    ΦeRadiation Power12001500mwIF=700mA
    VFForward Voltage3.23.8vIF=700mA
    λdWave lengthnmIF=700mA
    λpPeakWavelength365370nmIF=700mA
    20-1/250% power angle120degIF=700mA
    IRReverse Current20uAVR = 5V

    Electro-Optical Characteristics (Ta=25℃)

    Item

    Symbol


    Absolute Maximum Rating


    Units

    Power dissipationPd

    3

    W
    DC Forward CurrentIF700mA
    Peak Forward CurrentIFp800mA
    Reverse VoltageVR5V
    Operating TemperatureTopr-20 ~ +85 ℃
    Storage TemperatureTstg-40 ~ +100 ℃
    Junction TemperatureTj100°C

    Tapping specifications (Units: mm)

    Tape Dimensions: Loaded Quantity 1000pcs per reel

    0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing



    Application


    0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing

    0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing


    Precautions for use :


    Soldering

    SMD LED encapsulation gumwater is flexible, and external force easily damages radiant surface and plastic shell.So when soldering , Please handle with care!

    A. Reflow soldering shall be not more than two times and is suggested to be taken under reflow curve conditions with No-clean Flux, .The radiant surface shall be clean and unclean surface may influence the emitting color.

    B. Manual soldering is only used for reparing. Anti-static iron (25W) is recommended and tweezer or iron should not touch the radiant surface and plastic parts. The soldering time should be not more than 3 seconds.

    C. Don’t twist LED in course of manual soldering and testing, which may cause LED failure.

    D. Please select the LED devices in the same BIN on the same PCB, otherwise may cause chromatic aberration.


    Cleaning

    A . Ultrasonic cleaning is not allowed. We recommend isopropyl alcohol or pure alcohol to for cleaning or dipping within 1 minute and reuse after 15 minutes in room temperature. LThe radiant surface shall be clean after cleaning and other wisemayh influence radiant color.

    B. Isoamyl acetate, trichloroethylene, acetone, sulfide, nitride, acid, alkali and salt shall be avoided from LED, which may cause damage to LED.


    Encapsulation

    A . Encapsulation glue containing sodium ion or sulfide shall be avoided, which may cause fading fluorescence powder (poisoning).

    B . When using normal encapsulation glue, trial testing is recommended for 168-hour operation before mass production.


    Storage

    A. The LED should be stored at 30℃ or less and 60%RH or less before opening the package. The storage shall not be over half a year.

    B. After opening the package, the LEDs should be kept at 30-35%RH or less, and should be used within 3 days.

    C. When temperature card shows 20% above after package opened, baking treatment shall be conducted before use(for reel package,: baking at 60±3℃ for 12 hrs; for bulk goods, baking at 120±5℃ for 4 hrs)

    D. Acid, alkali and corrosive gas should be avoided in storage environment and intensively shock and high magnetic field also avoided.


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    0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing


    0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing


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