Bridgelux 140-150LM/W High Power 400W 600W 800W PCB SMD Module With
SMD 3030 Customizable for Tower Pendant Light
Product Description
Product Information |
Item | 600W PCB SMD Board |
Size | 180*180MM |
Current | 3600mA |
Voltage | 75V*2 |
light color | 3000K/ 4000K/ 5000K/ 6000K |
Chip Brand | Bridgelux Chip |
CRI | 80 |
Luminous Flux Spanlife
| 84000-96000LM 50000 hours |
Specification
- LEDs Type: 600W SMD PCB Board
- Power: 600W
- Voltage: 75V*2
- Current: 3600mA
- Size: 180*180mm
- Luminous Flux: 84000-96000LM
- Color Rendering Index: ＞80
- Aluminum substrate thickness:2.0mm
- Thermal conductivity of aluminum substrate :2.0W
- The thickness of the copper foil:35UM
- Material: Gold Wire
- Chip Brand: Bridgelux Chip
Related products Parameters
| The scope of products | Specification | Series-Parallel | Current /Voltage | Luminous Efficacy | Luminous Efficacy |
Chandeliers
(Tower pendant lamp) | 300 WΦ110MM | 25C12B | 3600MA 75V | 130-140LM/W | 140-150LM/W |
| 400 WΦ110MM | 25C16B | 4800MA 75V | 130-140LM/W | 140-150LM/W |
| 500 WΦ180MM | 25C10B*2 | 3000MA 75V*2 | 130-140LM/W | 140-150LM/W |
| 600 WΦ180MM | 25C12B*2 | 3600MA 75V*2 | 130-140LM/W | 140-150LM/W |
| 800 WΦ240MM | 25C16B*2 | 4800MA 75V*2 | 130-140LM/W | 140-150LM/W |
| 1000 WΦ240MM | 25C20B*2 | 6000MA 75V*2 | 130-140LM/W | 140-150LM/W |
| 1200 WΦ315MM | 25C16B*3 | 4800MA 75V*3 | 130-140LM/W | 140-150LM/W |
Application
High Bay light/ Chandeliers/ Tower pendant lamp/ Flood light/
Street light
User Manuel
Storage
To avoid moisture, we recommend storage conditions for the unopened
LED +5 ~ +30℃ rela-tive humidity <60%. LED should be used within
168 Hrs. of opening the package. Please make sure to dehumidify and
vacuum pack the remaining/ unused LED. Dehumidifying condition:
+120℃±5℃ of 4Hrs. Effective age for the sealed led is one year.
The soldering precautions
Soldering conditions: Reflow soldering is not recommended for this
LED. If hand soldering, set sol-dering iron temperature at 350℃ and
soldering time not More than 5 seconds, after the first soldering,
make sure the substrate surface temperature returns to ambient
temperature before a second soldering. Please. make sure when
soldering, there is no external force on the soldering surface and
silicon batardeau (such as pressure, friction or sharp metal nails,
etc.), to avoid gold wire deformation or dam-age and other
abnormalities. If beyond recommended conditions, we cannot
guarantee the LED stability, please do the risk assessment first.
During assembly, please ensure that a good quality thermal paste is
applied and distributed evenly over the surface. While using
thermal pad (Heat Sink), make sure LED is firmly tightened and
there is no gap between surfaces. In such heat-media products,
through a pressure test of at least 500 volts.
Anti-static measures
Please take adequate measures to prevent electrostatic generation,
such as wearing electrostatic ring or anti-static fingerstall etc;
any relative products like plant equipment, machinery, carrier and
transpor-tation units shall be connected to discharging unit/
ground. The ESD sensitivity of this product is > 1000V(HBM),
after assembly the final lamp, please make sure to discharge Static
Electricity by proper ESD equipment.
Temperature control
Recommended temperature conditions for enhanced product life: Be
sure to TS point (negative pads) controlled below 85℃, COB
recommendation colloid surface temperature control ≤150℃.
The drive control
Drive this product at constant current. Output current range
specifications should be ac-cording to the operational and other
conditions, as mentioned in data sheet. Before using a constant
voltage source or altered specifications other than recommended,
please consider risk factors.
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